Contract Manufacturing RAK4270 Moisture Sensitivity Level

LPWAN Modules / EVBs
1

Hi

We are manufacturing devices with RAK4270, I am wondering if we need to bake them first before PCBA.

Is it like a MSL 1 component or a MSL 3 component?

Thanks
Jacky Jiang

2

It is a MSL3 component, as stated in our datasheet:
Recommended Reflow Profile