We’re considering using the RAK2287 in a new product under development. We have clearance from the main PCB to enclosure of 7.0mm. The mPCIe connector we have leaves 1.6mm clearance between main PCB and mPCIe underside.
The RAK2287 with the heatsink fitted will not fit in our enclosure (Total height 10.6 mm with our 1.6mm connector). With the heatsink removed, the board will fit within our enclosure (total height approx 3.3mm+ 1.6mm = 4.9mm). We can fit thermal pad between the top side of the RAK2287 board our diecast enclosure to provide heat-sinking.
Is it possible / recommended to remove the provided heat-sink from the RAK2287 and to provide alternative heat-sinking configuration?