Hello everyone,
First of all, I’m a beginner, so sorry if this is a basic question. I just want to make sure my first PCB works properly 
I want to use the RAK3172-8-SM-I as the main chip on my two-layer PCB. I have to route a few low-speed traces on the top layer beneath the module (3.3V, RST, SDA and SCL). SDA and SCL are rarely used, and RST is almost always pulled high. There is also a GND copper pour on the bottom layer and on the top layer around these traces.
The datasheet doesn’t mention any keep-out or copper recommendations beneath the module, so my questions are:
- Is it OK to have these traces and the GND copper pours beneath the RAK3172, or should I add a keep-out area under the module?
- Is it a problem to have copper (traces or pour) beneath the antenna area of the module?
- Should vias beneath the module be tented (covered with solder mask)?
- Are there other common mistakes I should watch out for?
I’ve attached screenshots of my layout (top layer, bottom layer) and the schematic below.
Thank you very much!